A method for 103Pd molecular plating
onto the surface of the copper rod is reported. The optimal composition of the plating bath was: palladium chloride 2 g/l, ammonium hydroxide (28%) 150 ml/l, sodium hypophosphite 12 g/l, and ammonium chloride 37 g/l. The whole procedure of 103Pd
molecular plating
will last 50 minutes at 40 °C. This article provides valuable experience for the preparation of 103Pd seeds.