Authors:
H. Mehner Academy of Sciences of the GDR Central Institute of Physical Chemistry DDR-1199 Berlin-Adlershof (GDR)

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A. Vértes L. Eötvös University Laboratory of Nuclear Chemistry H-1088 Budapest (Hungary)

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Abstract  

Besides -Sn, a Ni–Sn alloy was identified by means of Mössbauer investigations on tin plated nickel foils formed during the electrodeposition of119Sn on nickel substrate. The average thickness of the layer caused by electroimplantation is about 80 to 100 nm on each side of the sample. The amount of the Ni–Sn alloy increases by heat treatment and the activation energy of the interdiffusion Q=102.5±2 kJ/mol was determined. A diffusion into the substrate could not be observed for electrodeposited119Sn on aluminium even at temperatures above the melting point of tin.

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Journal of Radionalytical and Nuclear Chemistry
Language English
Size A4
Year of
Foundation
1968
Volumes
per Year
1
Issues
per Year
12
Founder Akadémiai Kiadó
Founder's
Address
H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
Publisher Akadémiai Kiadó
Springer Nature Switzerland AG
Publisher's
Address
H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
CH-6330 Cham, Switzerland Gewerbestrasse 11.
Responsible
Publisher
Chief Executive Officer, Akadémiai Kiadó
ISSN 0236-5731 (Print)
ISSN 1588-2780 (Online)

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