Authors:
H. Mehner Academy of Sciences of the GDR Central Institute of Physical Chemistry DDR-1199 Berlin-Adlershof GDR

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A. Vértes L. Eötvös University Laboratory of Nuclear Chemistry H-1088 Budapest Hungary

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Abstract  

During electrodeposition of Sn on Ag substrate an interphase formation /electroimplantation/ could be observed. The average thickness of the formed alloy amounts to 35 nm. Heat treatment increases the thickness of the interphase, the activation energy of the interdiffusion process is 45.5±2 kJ mol–1. The system Sn on Pt substrate showed no electroimplantation. The diffusion during heat treatment has an activation energy of 126.2±2 kJ mol–1. Isomer shift of the formed alloys indicates that Pt diffuses preferentially into the tin layer.

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Journal of Radionalytical and Nuclear Chemistry
Language English
Size A4
Year of
Foundation
1968
Volumes
per Year
1
Issues
per Year
12
Founder Akadémiai Kiadó
Founder's
Address
H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
Publisher Akadémiai Kiadó
Springer Nature Switzerland AG
Publisher's
Address
H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
CH-6330 Cham, Switzerland Gewerbestrasse 11.
Responsible
Publisher
Chief Executive Officer, Akadémiai Kiadó
ISSN 0236-5731 (Print)
ISSN 1588-2780 (Online)