View More View Less
  • 1 Department of Mechanical and Material Engineering, Faculty of Engineering and Science (FES), Universiti Tunku Abdul Rahman (UTAR), Jalan Genting Kelang, Setapak, 53300, Kuala Lumpur, Malaysia
Restricted access

Abstract

Isotropic conductive adhesives (ICAs) are considered as the most promising replacement to lead-based solders due to relatively low melting point, simple processing and fine pitch capability. The study reports on the effect of volume fractions of silver flakes and particles on the curing reaction of ICAs. In addition, the thermal behavior of ICAs formulated with two types of polymeric adhesives: diglycidylether of bisphenol-A (DGEBA) and polyurethane (PU) was also investigated in this work. The increase in silver flakes concentration seem to reduce the melting temperature of the DEGBA and PU-based ICAs, which could be due to retardation of cross-linking of polymers due to silver flakes acting as barrier within the polymer matrix. In addition, the formulation of ICAs containing silver flakes and particles yielded a much higher reaction compared to conventional ICAs. The study showed that use of polyurethane (PU) as opposed to conventional Diglycidylether of bisphenol-A (DGEBA) showed a more stable system.

  • 1. Liu, J. Reliability of surface-mounted anisotropically conductive adhesive joints. Circuit World. 1993;19:2 .

  • 2. Gilleo, K. Assembly with conductive adhesives. Solder Surf Mount Technol. 1995;19:1217. .

  • 3. Li, L, Lizzul, C, Kim, H, Sacolick, I, Morris, JE. Electric, structure and processing properties of electrically conductive adhesives. IEEE Trans Compon Hybrids Manuf Technol. 1993;16:843 .

    • Crossref
    • Search Google Scholar
    • Export Citation
  • 4. Wu, SX, Mei, Y, Yeh, C, Wyatt, KW. Process induced residual stresses in isotropic conductive adhesive joints. IEEE Trans Compon Hybrids Manuf Technol C. 1996;19:251256. .

    • Crossref
    • Search Google Scholar
    • Export Citation
  • 5. Wong CP , Lu D. Recent advances on electrically conductive adhesives for electronics applications. In: Proceedings of 3rd international IEEE symposium on polymeric electronics packaging; 2000. p. 121128.

    • Search Google Scholar
    • Export Citation
  • 6. Lu D , Tong CK, Wong CP. conductivity mechanism of isotropic conductive adhesives (ICAs). In: International symposium on advanced packaging materials; 1999. p. 210.

    • Search Google Scholar
    • Export Citation
  • 7. Durairaj, R, Mallik, S, Seman, A, Marks, A, Ekere, NN. Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. J Mater Process Technol. 2009;209:39233930. .

    • Crossref
    • Search Google Scholar
    • Export Citation
  • 8. Sherman, K, Mackay, CA. A thermoanalytical study of the components and formulation of a resin based flux. J Solder Surface Mount Technol. 1990;6:2831. .

    • Crossref
    • Search Google Scholar
    • Export Citation
  • 9. Shimada Y , Lu D, Wong CP. Electrical characterizations and considerations of electrically condutive adhesives (ECAs). In: International symposium on advanced packaging materials; 2000. p. 336342.

    • Search Google Scholar
    • Export Citation
  • 10. Kottaus, S, Guenther, BH, Haug, R, Schafer, H. Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles. IEEE Trans Compon Hybrids Manuf Technol A. 1997;20:1520. .

    • Crossref
    • Search Google Scholar
    • Export Citation
  • 11. Markley DL , Tong QK, Magliocca DJ, Hahn TD. Characterization of silver flakes utilized for isotropic conductive adhesives. In: International symposium on advanced packaging materials, processes, properties and interfaces; 1999. p. 1620.

    • Search Google Scholar
    • Export Citation
  • 12. Khoo C , Liu J, Agren M, Hjerberg T. Influence of curing on electrical and mechanical reliability of conductive adhesive joints. In: Proceedings of the 1996 international electronics packaging society conference; 1996. p 483–501.

    • Search Google Scholar
    • Export Citation
  • 13. Guo, Q, Huang, Y, Zhang, Y-Y, Zhu, L-R, Zhang, B-L. Curing behavior of epoxy resins with a series of novel curing agents containing 4,′-biphenyl and varying methylene units. J Therm Anal Calorim. 2010;102:915922. .

    • Crossref
    • Search Google Scholar
    • Export Citation
  • 14. Jikan, S, Ariff, Z, Ariffin, A. Influence of filler content and processing parameter on the crystallization behaviour of PP/kaolin composites. J Therm Anal Calorim. 2010;102:10111017. .

    • Crossref
    • Search Google Scholar
    • Export Citation

Manuscript Submission: HERE

  • Impact Factor (2019): 2.731
  • Scimago Journal Rank (2019): 0.415
  • SJR Hirsch-Index (2019): 87
  • SJR Quartile Score (2019): Q3 Condensed Matter Physics
  • SJR Quartile Score (2019): Q3 Physical and Theoretical Chemistry
  • Impact Factor (2018): 2.471
  • Scimago Journal Rank (2018): 0.634
  • SJR Hirsch-Index (2018): 78
  • SJR Quartile Score (2018): Q2 Condensed Matter Physics
  • SJR Quartile Score (2018): Q2 Physical and Theoretical Chemistry

For subscription options, please visit the website of Springer.

Journal of Thermal Analysis and Calorimetry
Language English
Size A4
Year of
Foundation
1969
Volumes
per Year
4
Issues
per Year
24
Founder Akadémiai Kiadó
Founder's
Address
H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
Publisher Akadémiai Kiadó
Springer Nature Switzerland AG
Publisher's
Address
H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
CH-6330 Cham, Switzerland Gewerbestrasse 11.
Responsible
Publisher
Chief Executive Officer, Akadémiai Kiadó
ISSN 1388-6150 (Print)
ISSN 1588-2926 (Online)

Monthly Content Usage

Abstract Views Full Text Views PDF Downloads
May 2021 0 0 0
Jun 2021 0 0 0
Jul 2021 3 0 0
Aug 2021 1 0 0
Sep 2021 0 0 0
Oct 2021 3 0 0
Nov 2021 0 0 0