Journal of Thermal Analysis and Calorimetry
Volume/Issue:
Volume 69: Issue 3
Microstructural control of b-silicon nitride ceramics to improve thermal conductivity
Authors:
K. Furuya Nissan Motor Co., Ltd Materials Research Laboratory 1 Natsushima-cho Yokosuka 237-8593 Japan 1 Natsushima-cho Yokosuka 237-8593 Japan

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F. Munakata Nissan Motor Co., Ltd Materials Research Laboratory 1 Natsushima-cho Yokosuka 237-8593 Japan 1 Natsushima-cho Yokosuka 237-8593 Japan

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K. Matsuo National Institute for Advanced Industrial Science and Technology Smart Structure Research Center 1-1-1, Umezono Tsukuba 305-8568 Japan 1-1-1, Umezono Tsukuba 305-8568 Japan

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Y. Akimune National Institute for Advanced Industrial Science and Technology Smart Structure Research Center 1-1-1, Umezono Tsukuba 305-8568 Japan 1-1-1, Umezono Tsukuba 305-8568 Japan

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J. Ye NISSAN ARC, Ltd Research Department 1 Natsushima-cho Yokosuka 237-0061 Japan 1 Natsushima-cho Yokosuka 237-0061 Japan

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A. Okada Nissan Motor Co., Ltd Materials Research Laboratory 1 Natsushima-cho Yokosuka 237-8593 Japan 1 Natsushima-cho Yokosuka 237-8593 Japan

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Pages:
873–879
Online Publication Date:
02 Nov 2004
Publication Date:
01 Jul 2002
Article Category:
Research Article
DOI:
https://doi.org/10.1023/a:1020660006988
Keywords:
β-Si3N4 seed crystal; selective grain growth sintering; thermal conductivity
Restricted access

Abstract  

An advanced silicon nitride material with high isotropic thermal conductivity (149 W m-1 K-1) has been developed. This high thermal conductivity was achieved with a process that combines high-quality seed crystals with a suitable additive system to promote grain growth. In this process, the addition of β-Si3N4 seed crystals was found to be effective in improving thermal conductivity due to their low defect and impurity concentrations. The seed crystals seem to work as nuclei for controlling grain growth during the sintering process. Controlling the growth of elongated grains so that they do not interact with each other seems important for suppressing the generation of new defects inside the grains.

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Cover Journal of Thermal Analysis and Calorimetry
Journal of Thermal Analysis and Calorimetry
Print ISSN:
1388-6150
Online ISSN:
1572-8943

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Journal of Thermal Analysis and Calorimetry
Language English
Size A4
Year of
Foundation		 1969
Volumes
per Year		 1
Issues
per Year		 24
Founder Akadémiai Kiadó
Founder's
Address		 H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
Publisher Akadémiai Kiadó
Springer Nature Switzerland AG
Publisher's
Address		 H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
CH-6330 Cham, Switzerland Gewerbestrasse 11.
Responsible
Publisher		 Chief Executive Officer, Akadémiai Kiadó
ISSN 1388-6150 (Print)
ISSN 1588-2926 (Online)

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