Authors:
M. Khan Jamia Millia Islamia University Material Research Laboratory, Department of Chemistry New Delhi 110025 India

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S. Ashraf Jamia Millia Islamia University Material Research Laboratory, Department of Chemistry New Delhi 110025 India

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Abstract  

Thermal properties of control phenol formaldehyde (cpf) adhesive and lignin substituted phenol formaldehyde (lpf) adhesives have been investigated in detail. The effect of varying lignin mass percent of phenol and source of lignin like bagasse, eucalyptus bark, coconut coirpith and coffee bean shell on the thermal stability have been studied using thermogravimetric analysis (TG) and differential scanning calorimetry (DSC). 50 mass% of lignin loading in cpf adhesive shows better bond strength, whereas lignin incorporation up to 25 mass% yields a resin of thermal stability comparable to cpf. Loading of lignin in cpf delays the first thermal transition event. The mass loss in this event was found to increase with increasing lignin content. Lignin source has significant effect on the thermal stability of lpf resins. Rate of curing is enhanced by incorporation of lignin into cpf.

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Journal of Thermal Analysis and Calorimetry
Language English
Size A4
Year of
Foundation
1969
Volumes
per Year
1
Issues
per Year
24
Founder Akadémiai Kiadó
Founder's
Address
H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
Publisher Akadémiai Kiadó
Springer Nature Switzerland AG
Publisher's
Address
H-1117 Budapest, Hungary 1516 Budapest, PO Box 245.
CH-6330 Cham, Switzerland Gewerbestrasse 11.
Responsible
Publisher
Chief Executive Officer, Akadémiai Kiadó
ISSN 1388-6150 (Print)
ISSN 1588-2926 (Online)

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