Thermal behaviour of industrial UF resins modified by low level of melamine was followed by TG-DTA technique on the labsysTM instrument Setaram together with the 13C NMR analysis of resin structure and testing boards in current production at Estonian particleboard factory Pärnu Plaaditehas AS. DTA curve of UF resin which has been cocondensed during synthesis with even low level of melamine shows the shift of condensation exotherm and water evaporation endotherm to considerable higher temperatures. The effect of melamine monomer introduced to UF resin just before curing was compared. The effect of addition of urea as formaldehyde scavenger was studied.