One of the most important manufacturing steps for efficient modules is the encapsulation of the control circuit and the design of the echelon height and convexity value between the casing and the circuit. The paper presents the current manufacturing technology and the development of tools and technology driven by the customers’ requirements. For this reason, a new gluing tool has been developed in the report including a pneumatic open-close machine and special use of plasma technology designed for decreasing the setting time of the glue. The development includes the design of the workplace, working requirements and the optimisation of the expenses. In the paper the results are reported with specific industrial experiences.