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Journal of Radioanalytical and Nuclear Chemistry
Authors:
G. Choppin
,
J. Mathur
,
D. Singh
,
M. Mallekav
, and
P. Thakur
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Thermal analysis on influence of compatibilizing agents

Effect of vulcanization of incompatible elastomer blend

Journal of Thermal Analysis and Calorimetry
Authors:
K. Pandey
,
K. Debnath
,
P. Rajagopalan
,
D. Setua
, and
G. Mathur

Abstract  

Studies have been made on differential scanning calorimetry (DSC), thermogravimetric analysis (TG) and dynamic mechanical analysis (DMA) of binary blends of isobutylene-isoprene (IIR) copolymer and polychloroprene (CR) elastomers. Blends of IIR and CR are incompatible and showed separateT g peaks in DSC curves similar to Tanδ peaks. However, addition of chlorinated polyethylene (CM) elastomer, as compatibilizer, imparts miscibility between IIR and CR which could be judged both through DSC as well as by dynamic loss measurements (Loss modulusE″ and Tanδ). The storage modulus (E′) showed variation of stiffness due to structural changes associated with the addition of compatibilizer. TG plots for these blends showed improvement of thermal stability both by addition of a suitable compatibilizer as well as due to formation of crosslinked structures associated with the vulcanization of the blends by standard curative package.

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Abstract  

Polyimides have aromatic moieties in the backbone structure which are responsible for their increased thermal stability. If phosphorus is introduced in the main chain structure of polyimides, there is further improvement in the thermal stability. This has been proved by the work carried out in our group. The polyimide having amine termination can be used for crosslinking of epoxy resins. In the present study amine terminated phosphorus containing nadicimide were taken as curing agent for DGEBA resins. The curing characteristics of DGEBA resin were studied by DSC using different amounts of nadic endcapped phosphorylated amines. DSC thermogram showed the heat of polymerization was lower as compared to system cured with aromatic amines.

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Abstract  

Binary blends of poly (ether sulphone) (PES) and Nylon-6 were prepared in a whole range of composition by melt extrusion. Miscibility behaviour of the blends were studied using thermal analytical techniques like differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). Due to the rapid crystallization of Nylon-6 as it is cooled from the melt state, its glass transition behaviour could not be detected even in the quenched samples by DSC. Furthermore, the crystallization and melting behaviour of the blends have been studied by DSC. DMA results show that the dynamic storage modulus of the blends were in-between those of the constituent polymers. Also the glass transition of Nylon-6 phase as determined by the peak in loss tangent remains constant which shows that the two polymers are immiscible. Thermal expansion coefficient of the blends as determined by TMA is greater than that of Nylon-6 signifying the increased dimensional stability of the blends at higher temperatures. Morphological studies done by scanning electron microscopy (SEM) show the biphasic nature of the blends, with clear cut boundaries between the phases because of poor interfacial adhesion. Dispersed particle size is small when Nylon-6 is the dispersed phase because of its lower melt viscosity as compared to PES. Thermal stability of the blends was measured using thermogravimetric analysis (TG). Two-step decomposition behaviour was observed because of macro-phase separated morphology.

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Journal of Thermal Analysis and Calorimetry
Authors:
P. Rajagopalan
,
L. Kandpal
,
A. Tewary
,
R. Singh
,
K. Pandey
, and
G. Mathur

Abstract  

PEEK is characterised by high impact and fatigue resistance andT g of 145‡C. Blends of PEEK and PEI have been made and scanning electron micro-graphs of the broken specimen show that the two polymers are completely miscible in all proportions. The study also shows that PEEK∶PEI 50∶50 blend, can be used as matrix for composite applications with appreciable enhancement ofT g to 177‡C.

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