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  • Author or Editor: Maria Bruma x
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Abstract

The processing of polyimide films from polyamidic acid solutions involves the simultaeous loss of solvent and chemical conversion, and may imply structural reorganization such as orientation or crystallization. The effect of thermal treatment on the thermal, mechanical and dielectric properties of polymer films based on benzophenonetetracarboxylic dianhydride and 4,4’-diamino-3,3’-dimethyl diphenylmethane have been investigated. The thermal treatment of polyamidic acid at different temperatures led to compounds with different degree of imidization; it turned out that the imidization process took place with high speed until 240 °C and then remained constant. The dynamic mechanical analysis (DMA), contact angles, and dielectric measurements revealed that the storage modulus and contact angles increased with increasing of curing temperature while the dielectric constant decreased.

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Abstract  

Two aromatic polyimides and the corresponding poly(amic acid)s, with oxadiazole and para/meta phenoxyphenylene rings in the backbone, were synthesized and the structure — thermal properties correlation was followed by dynamic mechanical analysis. Concerning the poly(amic acid)s, the glass transition domain was emphasized only for the compound with meta-oriented rings because the process of imidization takes place with increasing temperature. A multiplex experiment was performed to calculate the activation energy of the transition localized under 200°C. Consecutive heating-cooling-heating cycles were accomplished. All phenomena are discussed by cross-examination of the storage modulus (E′), loss modulus (E″) and loss factor tanδ variation with temperature.

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