Authors:E. Bond, T. Bredeweg, J. FitzPatrick, M. Jandel, R. Rundberg, A. Slemmons, and D. Vieira
In this paper, we describe the separation chemistry and electrodepositions conducted for the preparation of 241Am, 243Am and 233U targets used for cross-section measurements at DANCE. Thick, adherent deposits were prepared using molecular plating from
isopropyl alcohol solutions. Improved yields and thicknesses were observed for 241Am electrodeposition after the material was purified using TRU resin from Eichrom. Similarly, 233U deposits were improved after purification with an anion exchange column in 9 M HBr followed by purification using UTEVA
resin from Eichrom.
Authors:Chunfu Zhang, Yongxian Wang, Haibin Tian, and Duanzhi Yin
A method for 103Pd molecular plating onto the surface of the copper rod is reported. The optimal composition of the plating bath was: palladium chloride 2 g/l, ammonium hydroxide (28%) 150 ml/l, sodium hypophosphite 12 g/l, and ammonium chloride 37 g/l. The whole procedure of 103Pd molecular plating will last 50 minutes at 40 °C. This article provides valuable experience for the preparation of 103Pd seeds.
Recovery of226Ra in analysis is determined using225Ra separated by anion exchange from229Th and233U. Radium is coprecipitated with barium, and purified by ion exchange.226Ra and217At (decay product of225Ra) are measured by α-spectrometry.228Ra is determined both by β-counting228Ac and225Ac separated from228Ra and225Ra, and by α-counting its daughters after the decay of225Ra. Sources for α-spectrometry are prepared by electrodeposition (molecular plating).