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nanoparticles particles on the mechanical properties and the curing behavior of an epoxy nanocomposite. Experimental Sample preparation Epoxy nanocomposites were prepared using ZnO nanoparticles. To this end

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. Nanocrystalline materials, playing the part of one of the phases of nanocomposite, can contribute to the occurrence of strengthening phenomena not existing in conventional materials of micrometric size. Metal matrix composites (MMCs) are the focus of

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/ATH/Fe-OMT nanocomposites were prepared and characterized [ 5 ]. The structure of PP/ATH/Fe-OMT nanocomposites was exfoliated, which were characterized by XRD and TEM. The thermal stability and flame retardancy of PP/ATH/Fe-OMT nanocomposites were better than that of PP

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associated predominance of interfaces in the nanocomposites, can function as structure and morphology directors [ 1 ]. Small amount addition of nanoclays or other nanoparticles into polymer products has been extensively utilized in an attempt to enhance the

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Introduction Flurry of research activity has occurred in producing polymer composites and nanocomposites by incorporating inorganic nanoparticles [ 1 ]. The unique properties of nanoparticles are due to quantum-confinement or

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Rheology of nanocomposites

Modelling and interpretation of nanofiller influence

Journal of Thermal Analysis and Calorimetry
Authors: Christophe Block, Nick Watzeels, Hubert Rahier, Bruno Van Mele, and Guy Van Assche

creates better materials with the envisaged properties. Composite materials have been around for ages and have already proved their use. In recent years an increasing interest is shown in nanocomposites. By choosing fillers with at least one dimension in

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Abstract  

We have used molecular simulations to study the properties of nanocomposites formed by the chemical incorporation of polyhedral oligomeric silsesquioxane (POSS) particles in the cross-linked epoxy network. The particular POSS molecule chosen—glycidyloxypropyl-heptaphenyl POSS—can form only one bond with the cross-linker and thus was present as a dangling unit in the network. Four epoxy-POSS nanocomposites containing different fractions (up to 30 mass/%) of POSS particles were studied in this work. Well-relaxed atomistic model structures of the nanocomposites were created and then molecular dynamics simulations were used to characterize the density, glass transition temperature (T g), and the coefficient of volume thermal expansion (CVTE) of the systems. In addition to the effect of nanoparticle loading, the effect of nanoparticle chemistry on the nanocomposite properties was also characterized by comparing these results with our previous results (Lin and Khare, Macromolecules 42:4319–4327, 2009) on neat cross-linked epoxy and a nanocomposite containing a POSS nanoparticle that formed eight bonds with the cross-linked network. Our results showed that incorporation of these monofunctional POSS particles into cross-linked epoxy does not cause a measurable change in its density, glass transition temperature, or the CVTE. Furthermore, simulation results were used to characterize the aggregation of POSS particles in the system. The nanofiller particles in systems containing 11, 20, and 30 mass/% POSS were found to form small clusters. The cluster-size distribution of nanoparticles was also characterized for these systems.

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rate of 2 °C/min up to 700 °C and held for 1 h in flowing of oxygen. Preparation of Bi 2 O 3 To compare the visible-light photocatalytic activity of the prepared WO 3 /Bi 3 O 4 Cl nanocomposite, Bi 2 O 3 was prepared

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]. Electrospinning (ES) has been widely investigated and proved to be an effective way to prepare high performance nanocomposite fibers. By adopting appropriate surface modification of inorganic fillers, solution properties, and processing conditions, electrospun

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Journal of Thermal Analysis and Calorimetry
Authors: Niko Van den Brande, Cor Koning, Paul Geerlings, Gregory Van Lier, Guy Van Assche, and Bruno Van Mele

Introduction Nanocomposites have become increasingly important over the last 20 years [ 1 ]. A promising application lies in the field of electromagnetic shielding and antistatics, where cheap and lightweight conducting

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