Authors:M. Villanueva, J. Martín-Iglesias, J. Rodríguez-Añón, and J. Proupín-Castiñeiras
The thermal degradation of the epoxy system diglycidyl ether of bisphenol A (DGEBA n=0) and m-xylylenediamine (mXDA) containing different concentrations of polyhedral oligomeric silsesquioxanes (POSS) nanoparticles was studied by thermogravimetric
analysis in order to determine the influence of both, the POSS concentration and the curing cycle on the degradation process
and to compare it with the results for the non modified system.
Glass transition temperatures for the same systems were also determined by differential scanning calorimetry. Different behaviors
have been observed, depending on the POSS concentration and on the curing selection.