The research work presented in this paper is based on results achieved within the TÁMOP-4.2.1.B-10/2/KONV-2010-0001 project and was carried out as part of the TÁMOP-4.2.2.A-11/1/KONV-2012-0019 project in the framework of the New Széchenyi Plan. The realization of this project is supported by the European Union and cofinanced by the European Social Fund. The research work of P. Baumli was supported by the János Bolyai Research Fellowship of the Hungarian Academy of Sciences.
The authors are grateful to Anna Sycheva and Mária Kiss Svéda for the SEM investigation and Mrs. Anikó Markus and Mrs. Katalin Molnár for the sample preparation.
Handwerker, C.; Kattner, U.; Moon, K. W. Fundamental properties of Pb-free solder alloys. In: Lead free Soldering , ed. Bath, J. Springer , US , 2007 , pp. 21 –74 .
Vianco, T. P. Development of alternatives to lead-bearing solders. In: Proceedings of the Technical Program on Surface Mount International , San Jose, CA, 19 August–2 September 1993.
Gyenes, A.; Lanszki, P.; Nagy, E.; Gácsi, Z. Nikkellel mikroötvözött Sn–0,7Cu ólommentes forraszanyagok vizsgálata (Investigation of nickel microalloyed Sn–0.7Cu lead-free solders) , Bányászati és kohászati lapok. Kohászat 2014 , 147 , 12 –17 .
Siewert, T.; Liu, S.; Smith, D. R.; Madeni, J. C. Database for solder properties with emphasis on new lead-free solder, properties of lead-free solders (release 4.0). NIST & Colorado School of Mines , Golden, CO , United States , 2002 .